The Technology of Wafers and Waffles I
Operational Aspects
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Product details:
- Publisher Elsevier Science
- Date of Publication 18 May 2017
- ISBN 9780128094389
- Binding Paperback
- No. of pages712 pages
- Size 234x190 mm
- Weight 1470 g
- Language English 0
Categories
Long description:
The Technology of Wafers and Waffles: Operational Aspects is the definitive reference book on wafer and waffle technology and manufacture. It covers specific ingredient technology (including water quality, wheat flour, starches, dextrins, oils and fats) and delves extensively into the manufacturing elements and technological themes in wafer manufacturing, including no/low sugar wafers, hygroscopic wafers, fillings and enrobing.
The book explains, in detail, operating procedures such as mixing, baking, filling, cooling, cutting and packaging for every type of wafer: flat and shaped wafers for making biscuits, ice cream cones, cups, wafer reels, wafer sticks (flute wafers) and biscuit wafers. It also explores the various types of European (Belgian) waffles and North American frozen waffles.
MoreTable of Contents:
1. Introduction2. Technology of Main Ingredients--Water and Flours3. Technology of Main Ingredients--Sweeteners and Lipids4. Technology of Minor Ingredients for Wafers and Waffles5. Adjuncts--Filling Creams, Inclusions, Cacao and Chocolate6. Wafer Sheets: Technology and Products7. Technology of Other Crisp Wafers8. After Bake Technology of Crisp Wafers and of Waffles9. Waffles: An Overview in Technology
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