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  • Failure-Free Integrated Circuit Packages: Systematic Elimination of Failures

    Failure-Free Integrated Circuit Packages by Cohn, Charles; Harper, Charles;

    Systematic Elimination of Failures

    Series: ELECTRONICS;

      • GET 10% OFF

      • The discount is only available for 'Alert of Favourite Topics' newsletter recipients.
      • Publisher's listprice GBP 117.99
      • The price is estimated because at the time of ordering we do not know what conversion rates will apply to HUF / product currency when the book arrives. In case HUF is weaker, the price increases slightly, in case HUF is stronger, the price goes lower slightly.

        56 369 Ft (53 685 Ft + 5% VAT)
      • Discount 10% (cc. 5 637 Ft off)
      • Discounted price 50 732 Ft (48 317 Ft + 5% VAT)

    56 369 Ft

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    printed on demand

    Why don't you give exact delivery time?

    Delivery time is estimated on our previous experiences. We give estimations only, because we order from outside Hungary, and the delivery time mainly depends on how quickly the publisher supplies the book. Faster or slower deliveries both happen, but we do our best to supply as quickly as possible.

    Product details:

    • Publisher McGraw Hill
    • Date of Publication 16 September 2004

    • ISBN 9780071434843
    • Binding Hardback
    • No. of pages366 pages
    • Size 231x157x33 mm
    • Weight 676 g
    • Language English
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    Short description:

    The shrinking of integrated circuits (ICs) puts tremendous stress on overall device reliability. This unique treatment uses graphic illustration to clearly identify all major failure mode types, so engineers can spot failures before they occur.

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    Long description:

    The shrinking of integrated circuits (ICs) puts tremendous stress on overall device reliability. This unique treatment uses graphic illustration to clearly identify all major failure mode types, so engineers can spot failures before they occur.

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    Table of Contents:

    Chapter 1 Introduction

    Chapter 2 Fundamentals of IC Package Technologies

    Chapter 3 Device Reliability

    Chapter 4 Physics and Chemistry of Failures in Packaged Devices

    Chapter 5 Strategies for Locating Failures

    Chapter 6 Failure Analysis Techniques

    Chapter 7 Examples of Failure Modes Common in Organic IC Packages

    Chapter 8 Emerging Assembly Materials for IC Packaging

    Index

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