Area Array Package Design
Techniques in High Density Electronics
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42 997 Ft
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Product details:
- Publisher McGraw-Hill Professional
- Date of Publication 1 November 2003
- ISBN 9780071428279
- Binding Hardback
- No. of pages204 pages
- Size 233x190x21 mm
- Weight 590 g
- Language English 0
Categories
Short description:
This comprehensive tutorial on area array package design features the most important new techniques, clearly explained by a team of world-class professionals and researchers. Area Array Package Design provides hands-on expertise and leading-edge information on flip chip, BGA, and MEMs methods.
* Expert design information that can save days of searching
* New 3D approaches
* Solutions to MEMS challenges
* Coverage of economic, environmental, standards compliance, failure analysis, and other essential considerations
* Technology history and background
*90 illustrations clarifying key concepts
From the editor of Area Array Packaging Handbook: Manufacturing and Assembly; Handbook of Flexible Circuits; and Polymer Thick Film More
Long description:
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
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