Advanced Copper-Gold Wire-Stud Interconnection Technologies
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50 158 Ft (47 770 Ft + 5% VAT)
The price is estimated because at the time of ordering we do not know what conversion rates will apply to HUF / product currency when the book arrives. In case HUF is weaker, the price increases slightly, in case HUF is stronger, the price goes lower slightly.
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50 158 Ft
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Delivery time is estimated on our previous experiences. We give estimations only, because we order from outside Hungary, and the delivery time mainly depends on how quickly the publisher supplies the book. Faster or slower deliveries both happen, but we do our best to supply as quickly as possible.
Product details:
- Publisher McGraw-Hill Education
- Date of Publication 16 August 2012
- ISBN 9780071785167
- Binding Hardback
- No. of pages480 pages
- Language English 0
Categories
Short description:
This professional book contains essential information on developing low-cost, high-performance electronic products using relatively inexpensive copper wire, copper stud, and gold stud bonding for the design and manufacture of reliable semiconductor chips.
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