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Product details:
- Edition number 2
- Publisher Springer International Publishing
- Date of Publication 6 October 2023
- Number of Volumes 1 pieces, Book
- ISBN 9783030983222
- Binding Hardback
- No. of pages918 pages
- Size 235x155 mm
- Weight 1802 g
- Language English
- Illustrations X, 918 p. 630 illus., 471 illus. in color. Illustrations, black & white 501
Categories
Long description:
This book covers the application technology of lasers, focusing more on the vast range of processes than on individual applications, in order to motivate and enable future innovations. The physical basics are presented in the first half of the book. The following examination of application categories and their processes is documented by experts from their practical points of view but always refers back to the underlying physical principles. In this way, readers are free to choose their own individual level of depth in understanding this globally relevant field of innovation.
This new edition of Tailored Light 2: Laser Applications birings the book up to date with the latest applications of laster technology.
Table of Contents:
Physical Basics.- Industrial Laser System.- Beam Shaping for Laser Treatment.- Adapted Beam Shaping Using Free-form Optics.- Laser Softening.- Transformation Hardening.- Polishing with Laser Radiation.- Laser Powder Bed Fusion.- LMD-Introduction.- LMD Fundamentals.- System Technology.- Extreme High-speed Laser Material Deposition – EHLA.- Wire Laser Metal Deposition.- Hybrid AM and Process Chains.- Applications.- Materials for Additive Manufacturing.- Additive Manufacturing of Embedded Sensors.- Laser Induced Forward Transfer – LIFT.- Stereolithography for Biofabrication.- Thin and Thick Film Processing.- Bending.- Heat Conduction Mode Welding.- Laser Beam Welding of Thermoplastics.- Laser Transmission Bonding.- Soldering.- Laserbeam Microwelding.- Hybrid Lightweight Components.- Laser-based Glass Frit Bonding.- Transparent Materials.- Thin Film Ablation.- Cleaning.- Drilling.- Fusion Cutting.- High Speed Cutting.- Sublimation Cutting.- Remote Cutting.- Laser Fine Cutting.- ProcessMonitoring.- Numerically Controlled Tooling Machines for Laser Materials Processing.- Optical Coherence Tomography.- Laser-induced Breakdown Spectroscopy.- Light scattering for Inline Process Monitoring.- Pulsed Plasma EUV Sources.- EUV Optics.- EUV Measurement Technologies.
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