Fundamentals of Microsystems Packaging
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56 884 Ft
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Product details:
- Publisher McGraw-Hill Education
- Date of Publication 16 June 2001
- ISBN 9780071371698
- Binding Hardback
- No. of pages967 pages
- Size 337x233x63 mm
- Weight 1874 g
- Language English 0
Categories
Short description:
The only book to teach microsystems packaging--written by the field's leading author
This is the book that engineers, technicians, and students want—the first to teach microsystems packaging from the ground up. Rao Tummala’s one-stop Fundamentals to Microsystems Packaging covers the field from wafer to systems, including every major contributing technology. It’s the only book to do so. This much-needed tool features:
*A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems.
*Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing
*Hundreds of explanatory two-color illustrations
*Self-test problems and solutions in every chapter
*Glossary
*The best way to learn microsystems packaging through self-study or in a classroom—and the most comprehensive on-the-job reference
MICROSystems PACKAGING
FROM THE GROUND UP
