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  • ETG-Fb. 173: CIPS 2024, CD-ROM: 13th International Conference on Integrated Power Electronics Systems, March, 12 - 14, 2024, Düsseldorf, Germany

    ETG-Fb. 173: CIPS 2024, CD-ROM by VDE ETG;

    13th International Conference on Integrated Power Electronics Systems, March, 12 - 14, 2024, Düsseldorf, Germany

    Series: ETG-Fachberichte;

      • GET 5% OFF

      • The discount is only available for 'Alert of Favourite Topics' newsletter recipients.
      • Publisher's listprice EUR 307.00
      • The price is estimated because at the time of ordering we do not know what conversion rates will apply to HUF / product currency when the book arrives. In case HUF is weaker, the price increases slightly, in case HUF is stronger, the price goes lower slightly.

        127 328 Ft (121 265 Ft + 5% VAT)
      • Discount 5% (cc. 6 366 Ft off)
      • Discounted price 120 962 Ft (115 202 Ft + 5% VAT)

    127 328 Ft

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    Availability

    Only to order.

    Why don't you give exact delivery time?

    Delivery time is estimated on our previous experiences. We give estimations only, because we order from outside Hungary, and the delivery time mainly depends on how quickly the publisher supplies the book. Faster or slower deliveries both happen, but we do our best to supply as quickly as possible.

    Product details:

    • Edition number Neuerscheinung
    • Publisher VDE-Verlag
    • Date of Publication 1 January 2024

    • ISBN 9783800762880
    • Binding Unidentified
    • No. of pages730 pages
    • Size 140x124 mm
    • Weight 56 g
    • Language English
    • 525

    Categories

    Long description:

    In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will include advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration).CIPS is consequently focused on the following main aspects:- assembly and interconnect technology for power electronic devices and converters- integration of hybrid systems and mechatronic systems with high power density- systems´ and components' operational behaviour and reliability

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