Encapsulation Technologies for Electronic Applications
Series: Materials and Processes for Electronic Applications;
- Publisher's listprice EUR 206.00
-
80 463 Ft (76 632 Ft + 5% VAT)
The price is estimated because at the time of ordering we do not know what conversion rates will apply to HUF / product currency when the book arrives. In case HUF is weaker, the price increases slightly, in case HUF is stronger, the price goes lower slightly.
- Discount 10% (cc. 8 046 Ft off)
- Discounted price 72 417 Ft (68 969 Ft + 5% VAT)
Subcribe now and take benefit of a favourable price.
Subscribe
80 463 Ft
Availability
printed on demand
Why don't you give exact delivery time?
Delivery time is estimated on our previous experiences. We give estimations only, because we order from outside Hungary, and the delivery time mainly depends on how quickly the publisher supplies the book. Faster or slower deliveries both happen, but we do our best to supply as quickly as possible.
Product details:
- Edition number 2
- Publisher Elsevier Science
- Date of Publication 11 October 2018
- ISBN 9780128119785
- Binding Paperback
- No. of pages508 pages
- Size 229x152 mm
- Weight 790 g
- Language English 0
Categories
Long description:
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages.
In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology.
Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.
MoreTable of Contents:
1. Introduction2. Plastic Encapsulant Materials3. Encapsulation Process Technology4. Characterization of Encapsulant Properties5. Encapsulation Defects and Failures6. Defect and Failure Analysis Techniques for Encapsulated Microelectronics7. Qualification and Quality Assurance8. Trends and Challenges
More
