WIRE BONDING IN MICROELECTRONICS, 3/E
Series: ELECTRONICS;
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Product details:
- Edition number 3
- Publisher McGraw-Hill Education
- Date of Publication 16 March 2010
- ISBN 9780071476232
- Binding Hardback
- No. of pages446 pages
- Size 238x162x29 mm
- Weight 796 g
- Language English 0
Categories
Long description:
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
The Industry Standard Guide to Wire Bonding--Fully Updated
The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.
COVERAGE INCLUDES:
- Ultrasonic bonding systems and technologies, including high-frequency systems
- Bonding wire metallurgy and characteristics, including copper wire
- Wire bond testing
- Gold-aluminum intermetallic compounds and other interface reactions
- Gold and nickel-based bond pad plating materials and problems
- Cleaning to improve bondability and reliability
- Mechanical problems in wire bonding
- High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bonds
- Copper, low-dielectric-constant (Cu/Lo-k) technology and problems
- Wire bonding process modeling and simulation
CD includes all of the book's full-color figures plus animations.
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
The Industry Standard Guide to Wire Bonding--Fully Updated
The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.
COVERAGE INCLUDES:
- Ultrasonic bonding systems and technologies, including high-frequency systems
- Bonding wire metallurgy and characteristics, including copper wire
- Wire bond testing
- Gold-aluminum intermetallic compounds and other interface reactions
- Gold and nickel-based bond pad plating materials and problems
- Cleaning to improve bondability and reliability
- Mechanical problems in wire bonding
- High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bonds
- Copper, low-dielectric-constant (Cu/Lo-k) technology and problems
- Wire bonding process modeling and simulation
CD includes all of the book's full-color figures plus animations.
MoreTable of Contents:
Introduction to Third Edition; Acknowledgments; Introduction to CD; Chapter 1. The Technical Introduction to the Third Edition; Chapter 2. Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism; Chapter 3. Bonding Wire Metallurgy and Characteristics That Can Affect Bonding, Reliability, or Testing; Chapter 4. Wire Bond Testing; Chapter 5. Gold-Aluminum Intermetallic Compounds and Other Metallic Interface Reactions in Wire Bonding; Chapter 6. Introduction to Plating, Section A (Gold) and Section B (Nickel-Based) Bond Pad Technology and Reliability; Chapter 7. Cleaning to Improve Bondability and Reliability; Chapter 8. Mechanical Problems in Wire Bonding; Chapter 9. Advanced and Specialized Wire Bonding Technologies; Chapter 10. An Overview of the Materials and Material Science of Copper, Low-k Devices that Affect Bonding and Packaging; Chapter 11. Wire Bonding Process Modeling and Simulation; Glossary; Bibliography; Index
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