Purple Plague in Microelectronics
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Product details:
- Edition number 1
- Publisher CRC Press
- Date of Publication 1 December 2025
- ISBN 9781041024248
- Binding Hardback
- No. of pages148 pages
- Size 234x156 mm
- Weight 453 g
- Language English
- Illustrations 23 Illustrations, black & white; 8 Illustrations, color; 11 Halftones, black & white; 2 Halftones, color; 12 Line drawings, black & white; 6 Line drawings, color; 5 Tables, black & white 700
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Short description:
This book is a comprehensive overview of the discoveries in composition, growth and control of gold-aluminum intermetallic compounds in microelectronic interconnects. It focuses on the history of detection, theory and understanding of the gold/aluminum interface reliability issues.
MoreLong description:
This book is a comprehensive overview of the discoveries in composition, growth and control of gold-aluminum intermetallic compounds in microelectronic interconnects known as purple plague. It focuses on the history of detection, theory, and understanding of the gold-aluminum interface reliability issues.
Purple Plague in Microelectronics presents research on the phenomenon of purple plague from the earliest days to the present. The authors explain intricate scientific aspects to understand cause and effect of this reliability issue in microelectronics in a way that ensures the content is understandable to readers of various educational levels, novice to expert, while satiating the needs of the engineering personnel closely associated with work related to the gold-aluminum interfacial integrity. The discovery of void formation leading to porosity in the purple phase and the resulting joint failure is discussed, along with detailed analyses of the various phases, metallurgy characteristics, and diffusion phenomenon at the gold-aluminum interface. They provide detailed drawings, graphs, charts, models, and tables, which allow easy comprehension of concepts and phenomenon through visual aids. The book explains various methods for evaluating the quality and reliability of wire bond joints, highlighting the relative advantages of each approach. Techniques such as shear testing and bond resistance testing are discussed in detail. It also examines the role of ingredients used in packaging material and the gold wire itself, supported by relevant mathematical models
Intended for electronic assembly engineers, design engineers, process development engineers, material scientists, electronic industry supervisors and managers, this book is an excellent reference for anyone involved in defect control and reliability in gold wire bonding.
Table of Contents:
Chapter 1 1892–1947: Early Materials Science; Chapter 2 1946: Flash of Brilliance; Chapter 3 1951: Purple Rising; Chapter 4 1964: Identification and Limitation; Chapter 5 1965: Purple Setting; Chapter 6 1970: First Detailed Failure Analysis and Metallurgy; Chapter 7 1971: IMC Formation Governed by Fickian Diffusion; Chapter 8 1976: Bond Shear Era Begins; Chapter 9 1982: Thermosonic Supplants Thermocompression – Active Intermetallic Compound Suppress; Chapter 10 1986: Take a Bromide?; Chapter 11 2000: Electrostatic Discharge Under Pad and Probe Marks; Chapter 12 2006: Impurities and the Reliability of Gold Wire; Chapter 13 Assessment of Au-Al Bond Interface Integrity; Chapter 14 Summary; Chapter 15 Glossary
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