Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition
A Practical Guide to Semiconductor Processing
Series: ELECTRONICS;
- Publisher's listprice GBP 133.99
-
60 496 Ft (57 615 Ft + 5% VAT)
The price is estimated because at the time of ordering we do not know what conversion rates will apply to HUF / product currency when the book arrives. In case HUF is weaker, the price increases slightly, in case HUF is stronger, the price goes lower slightly.
- Discount 10% (cc. 6 050 Ft off)
- Discounted price 54 446 Ft (51 854 Ft + 5% VAT)
Subcribe now and take benefit of a favourable price.
Subscribe
60 496 Ft
Availability
printed on demand
Why don't you give exact delivery time?
Delivery time is estimated on our previous experiences. We give estimations only, because we order from outside Hungary, and the delivery time mainly depends on how quickly the publisher supplies the book. Faster or slower deliveries both happen, but we do our best to supply as quickly as possible.
Product details:
- Edition number 6
- Publisher McGraw Hill
- Date of Publication 16 November 2013
- ISBN 9780071821018
- Binding Hardback
- No. of pages576 pages
- Size 241x195x36 mm
- Weight 1136 g
- Language English 0
Categories
Long description:
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
The most complete, current guide to semiconductor processing
Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.
State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.
COVERAGE INCLUDES:
- The semiconductor industry
- Properties of semiconductor materials and chemicals
- Crystal growth and silicon wafer preparation
- Wafer fabrication and packaging
- Contamination control
- Productivity and process yields
- Oxidation
- The ten-step patterning process--surface preparation to exposure; developing to final inspection
- Next generation lithography
- Doping
- Layer deposition
- Metallization
- Process and device evaluation
- The business of wafer fabrication
- Devices and integrated circuit formation
- Integrated circuits
- Packaging
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
The most complete, current guide to semiconductor processing
Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.
State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.
COVERAGE INCLUDES:
- The semiconductor industry
- Properties of semiconductor materials and chemicals
- Crystal growth and silicon wafer preparation
- Wafer fabrication and packaging
- Contamination control
- Productivity and process yields
- Oxidation
- The ten-step patterning process--surface preparation to exposure; developing to final inspection
- Next generation lithography
- Doping
- Layer deposition
- Metallization
- Process and device evaluation
- The business of wafer fabrication
- Devices and integrated circuit formation
- Integrated circuits
- Packaging
Table of Contents:
Ch 1. The Semiconductor Industry
Ch 2. Properties of Semiconductor Materials and Chemicals
Ch 3. Crystal Growth and Silicon Wafer Preparation
Ch 4. Overview of Wafer Fabrication
Ch 5. Contamination Control
Ch 6. Productivity and Process Yields
Ch 7. Oxidation
Ch 8. The Ten-Step Patterning Process--Surface Preparation to Exposure
Ch 9. The Ten-Step Patterning Process--Developing to Final Inspection
Ch 10. Advanced Photolithography Processes
Ch 11. Doping
Ch 12. Layer Deposition
Ch 13. Metalization
Ch 14. Process and Device Evaluation
Ch 15. The Business of Water Fabrication
Ch 16. Introduction to Device and Integrated Circuit Formation
Ch 17. Introduction to Integrated Circuits
Ch 18. Packaging
Glossary
Index