Handbook of Silicon Based MEMS Materials and Technologies
Series: Micro and Nano Technologies;
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Product details:
- Edition number 3
- Publisher Elsevier Science
- Date of Publication 17 April 2020
- ISBN 9780128177860
- Binding Paperback
- No. of pages1026 pages
- Size 276x216 mm
- Weight 2670 g
- Language English 4
Categories
Long description:
Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures.
The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students.
MoreTable of Contents:
Part I
1. Properties of silicon; Fracture toughness
2. Czochralski Growth of Silicon Crystals
3. Properties of Silicon Crystals
4. Silicon Wafers: Preparation and Properties; Modern technologies
5. Epi Wafers: Preparation and Properties
6. Thin Films on Silicon
7. Thick-Film SOI Wafers: Preparation and properties
Part II
8. Multiscale Modeling Methods
9. Mechanical Properties of Silicon Microstructures
10. Electrostatic and RF-Properties of MEMS Structures
11. Optical Modeling of MEMS
12. Modeling of Silicon Etching
13. Gas Damping in Vibrating MEMS Structures
14. Recent Progress in Large-scale Electronic State Calculations and Data-driven Sciences
Part III
15. MEMS Lithography
16. Deep Reactive Ion Etching; update
17. Wet Etching of Silicon
18. Porous Silicon Based MEMS
19. Surface Micromachining
20. Vapor Phase Etch Processes for Silicon MEMS
21. Inkjet Printing, Laser-Based Micromachining and Micro 3D Printing Technologies for MEMS
22. Microfluidics and BioMEMS in Silicon
Part IV
23. Silicon Direct Bonding
24. Anodic Bonding
25. Glass Frit Bonding
26. Metallic Alloy Seal Bonding
27. Emerging Wafer Bonding Technologies
28. Bonding of CMOS Processed Wafers
29. Wafer-Bonding Equipment
30. Encapsulation by Film Deposition
31. Dicing of MEMS Devices
32. 3D Integration of MEMS
33. Own chapter for eWLP
34. Through-Substrate Via Technologies for MEMS
35. Outgassing and Gettering
Part V
36. Silicon Wafer and Thin Film Measurements
37. Oxygen and Bulk Microdefects in Silicon
38. Optical Measurement of Static and Dynamic Displacement in MEMS
39. MEMS Residual Stress Characterization: Methodology and Perspective
40. Microscale deformation analysis
41. Strength of Bonded Interfaces
42. Hermeticity Tests
43. MEMS testing and calibration
44. MEMS Reliability
Part VI
45. Case Accelerometer
46. Case Gyroscope
47. Case Pressure Sensor
48. Case Microphone
49. Case Micromirror
50. Case Optical MEMs
