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  • Electronic Assembly Fabrication

    Electronic Assembly Fabrication by Harper, Charles;

    Series: ELECTRONICS;

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      • Publisher's listprice GBP 60.99
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    29 137 Ft

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    Product details:

    • Publisher McGraw-Hill Education
    • Date of Publication 16 April 2002

    • ISBN 9780071378826
    • Binding Hardback
    • No. of pages672 pages
    • Size 231x157x52 mm
    • Weight 1066 g
    • Language English
    • 0

    Categories

    Short description:

    Step-by-step coverage of the entire assembly fabrication process: boards, soldering, packages, substrates, and deposition

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    Long description:

    Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.






    YOUR STEP-BY-STEP GUIDE THROUGH THE ENTIRE ELECTRONIC ASSEMBLY FABRICATION PROCESS

    Electronic assemblies are the heart of all modern electronics. They house the essential chip, generate semiconductor input/output, and take care of the heat generated by the process. The explosive growth of communications and consumer electronics applications has suddenly made a knowledge of the fabrication process a very in-demand and lucrative skill.

    Even beginners, with no advanced degrees or mathematical backgrounds will be able to quickly and easily learn the entire electronic assembly fabrication process with this well-illustrated comprehensive tutorial. Author Charles Harper, a hands-on expert and experienced author covers the assembly process from start to finish, delving into:


    * Chips
    * Boards
    * Solders
    * Packages
    * Interconnections
    * Substrates
    * Deposition
    * Cleaning
    * Coating
    * The latest environmental rules and constraints

    ELECTRONIC ASSEMBLY FABRICATION will prove invaluable to nonspecialists and managers as well as engineers and technicians working in the development, marketing, or manufacture of electronic products, and anyone else who wants to get familiar with and profit from one of the major growth areas in the field of electronics.



    Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.






    YOUR STEP-BY-STEP GUIDE THROUGH THE ENTIRE ELECTRONIC ASSEMBLY FABRICATION PROCESS

    Electronic assemblies are the heart of all modern electronics. They house the essential chip, generate semiconductor input/output, and take care of the heat generated by the process. The explosive growth of communications and consumer electronics applications has suddenly made a knowledge of the fabrication process a very in-demand and lucrative skill.

    Even beginners, with no advanced degrees or mathematical backgrounds will be able to quickly and easily learn the entire electronic assembly fabrication process with this well-illustrated comprehensive tutorial. Author Charles Harper, a hands-on expert and experienced author covers the assembly process from start to finish, delving into:


    * Chips
    * Boards
    * Solders
    * Packages
    * Interconnections
    * Substrates
    * Deposition
    * Cleaning
    * Coating
    * The latest environmental rules and constraints

    ELECTRONIC ASSEMBLY FABRICATION will prove invaluable to nonspecialists and managers as well as engineers and technicians working in the development, marketing, or manufacture of electronic products, and anyone else who wants to get familiar with and profit from one of the major growth areas in the field of electronics.

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    Table of Contents:

    Preface

    Contributors

    Dedication

    Chapter 1: Printed Circuit History and Overview

    Chapter 2: Development and Fabrication of IC Chips

    Chapter 3: Packaging of IC Chips

    Chapter 4: Laminates and Prepregs as Circuit Board Base Materials

    Chapter 5: Printed Circuit Board Fabrication

    Chapter 6: Package and Component Attachment and Interconnection

    Chapter 7: Solder Materials and Processes for Electronic Assembly Fabrication

    Chapter 8: Printed Wiring Board Cleaning

    Chapter 9: Board Coating Materials and Processes

    Chapter 10: Flexible and Rigid Flexible Fabrication

    Chapter 11: Fabrication and Properties of Electronic Ceramics and Composites

    Chapter 12: Hybrid Microelectronics and Multichip Module Technologies

    Chapter 13: Environmental Considerations in Electronic Assembly Fabrication

    Index

    About the Editor

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