Computer-Aided Design of High-Temperature Materials
Series: Topics in Physical Chemistry;
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73 368 Ft
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Product details:
- Publisher OUP USA
- Date of Publication 19 August 1999
- ISBN 9780195120509
- Binding Hardback
- No. of pages538 pages
- Size 234x157x30 mm
- Weight 885 g
- Language English
- Illustrations numerous line figures 0
Categories
Short description:
This symposium volume will cover the latest research findings in high-temperature materials from a range of experimental and computational materials scientists.
MoreLong description:
High-temperature materials is a fast-moving research area with numerous practical applications. Materials that can withstand extremely high temperatures and extreme environments are generating considerable attention worldwide; however, designing materials that have low densities, elevated melting temperatures, oxidation resistance, creep resistance, and intrinsic toughness encompass some of the most challenging problems in materials science.
The current search for high-temperature materials is largely based on traditional, trial-and-error experimental methods which are costly and time-consuming. An effective way to accelerate research in this field is to use recent advances in materials simulations and high performance computing and communications (HPCC) to guide experiments. This synergy between experiment and advanced materials modeling will significantly enhance the synthesis of novel high-temperature materials.
This volume collects recent work from experimental and computational scientists on high-temperature materials and emphasizes the potential for collaboration. It features state-of-the-art materials modeling and recent experimental developments in high-temperature materials. Topics include fundamental phenomena and properties; measurements and modeling of interfacial phenomena, stresses, growth of defects, strain, and fracture; and electronic structure and molecular dynamics.
