
Multiple-Scale Analysis of Boundary-Value Problems in Thick Multi-Level Junctions of Type 3:2:2
Series: SpringerBriefs in Mathematics;
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Product details:
- Edition number 1st ed. 2019
- Publisher Springer
- Date of Publication 7 February 2020
- Number of Volumes 1 pieces, Book
- ISBN 9783030355364
- Binding Paperback
- No. of pages105 pages
- Size 235x155 mm
- Weight 454 g
- Language English
- Illustrations 5 Illustrations, black & white; 2 Illustrations, color 85
Categories
Long description:
This book presents asymptotic methods for boundary-value problems (linear and semilinear, elliptic and parabolic) in so-called thick multi-level junctions. These complicated structures appear in a large variety of applications.
A concise and readable introduction to the topic, the book provides a full review of the literature as well as a presentation of results of the authors, including the homogenization of boundary-value problems in thick multi-level junctions with non-Lipschitz boundaries, and the construction of approximations for solutions to semilinear problems.Including end-of-chapter conclusions discussing the results and their physical interpretations, this book will be of interest to researchers and graduate students in asymptotic analysis and applied mathematics as well as to physicists, chemists and engineers interested in processes such as heat and mass transfer.
?The book is well organized and each chapter contains a conclusion with comments and physical interpretation and can be useful to researchers and graduate students interested in asymptotic analysis and applied mathematics.? (Paolo Musolino, zbMATH 1443.35004, 2020)
MoreTable of Contents:
1 Introduction.- 2 Homogenization of Linear Elliptic Problems.- 3 Homogenization of Elliptic Problems in Thick Junctions with Sharp Edges.- 4 Homogenization of Semilinear Parabolic Problems.- 5 Asymptotic Approximations for Solutions to Semilinear Problems.- References.
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Multiple-Scale Analysis of Boundary-Value Problems in Thick Multi-Level Junctions of Type 3:2:2
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