Ceramic Interconnect Technology Handbook
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Estimated delivery time: In stock at the publisher, but not at Prospero's office. Delivery time approx. 3-5 weeks.
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Product details:
- Edition number 1
- Publisher CRC Press
- Date of Publication 24 January 2007
- ISBN 9780849335570
- Binding Hardback
- No. of pages456 pages
- Size 234x156 mm
- Weight 771 g
- Language English
- Illustrations 277 Illustrations, black & white; 108 Halftones, black & white; 53 Tables, black & white 0
Categories
Short description:
With their unique electrical and thermal properties, ceramics are ideal for application in a wide variety of electronic systems and products. However, they are relegated either to a single chapter in electronic packaging books or to older, dated treatments. Offering much more than a discourse on the materials science behind these technologies, this book offers comprehensive, up-to-date coverage of all aspects of ceramic interconnect technologies in electronics and electronic packaging. The authors authoritatively discuss trends in electronic packaging, electrical design, simulation, and testing, ceramic materials, and the various types of ceramic interconnects, devices, and applications.
MoreLong description:
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies.
Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates.
Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Table of Contents:
Overview of Ceramic Interconnect Technology. Electrical Design, Simulation, and Testing. ThermoMechanical Design. Ceramic Materials. Screen Printing. Multilayer Ceramics. Photo-Defined and Photo-Imaged Films. Copper Interconnects for Ceramic Substrates and Packages. Integrated Passives in Ceramic Substrates. Index.
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