Theory and Practice of Thermal Transient Testing of Electronic Components

Theory and Practice of Thermal Transient Testing of Electronic Components

 
Edition number: 1st ed. 2022
Publisher: Springer
Date of Publication:
Number of Volumes: 1 pieces, Book
 
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Product details:

ISBN13:9783030861735
ISBN10:3030861732
Binding:Hardback
No. of pages:385 pages
Size:235x155 mm
Weight:758 g
Language:English
Illustrations: IX, 385 p. Tables, color
582
Category:
Short description:

This book discusses the major aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book begins by presenting the theoretical background of creating structure functions from the measured results with mathematical details. It then moves on to show how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and the calibration of simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The special problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide band gap materials, and LEDs are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.

  • The first book dedicated solely to thermal transient testing;
  • Enables readers to accomplish thermal transient testing on any type of electronics;
  • Provides valuable use cases and highlights the specialties of characterizing different devices.


Long description:

This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed tounderstand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.

Table of Contents:
Introduction: the Importance and Motivation.- Theoretical Background: History, the Network Identification by Deconvolution (NID) Method, Structure Functions, the Thermal Signature.- The Use of Thermal Transient Testing.- General Practical Questions and the Flow of Thermal Transient Measurements.- On the Accuracy and Repeatability of Thermal Measurements.